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Interconnect Reliability Standard EIA/IPC J-STD-029 - Link to IPC |
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Interconnect Reliability Standard IPC-SM-785: "Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments" - View Excerpts |
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Interconnect Reliability Standard IPC-9701: "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments" - View Excerpts
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Solder Joint Failure (technical article by Werner Engelmaier) |
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Application Note: "Overcoming Environmental Noise" - Contact Analysis Tech |
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Application Note: "Designing Test Boards for STD Series Event Detectors" - Download |
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Application Note: Interconnect Reliability Issues (Engelmaier) - Download |
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Example Application: PBGA Testing (Motorola) - Download |
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Extensive library of specific Application Notes ... Contact Analysis Tech |
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Interconnect Reliability Testing - Download |
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W. Engelmaier, "Solder Joint Design for Reliability" - Download |
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L. R. Fox, J. W. Sofia, and M. C. Shine, "Investigation of Solder Fatigue Acceleration Factors", IEEE Comp., Hybrids, Manufact. Tech., vol. CHMT-8, no. 2, pp. 275-282, June 1985 - Download |
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Jeffrey Schutt, "Accelerate Interconnect Reliability Tests", Test & Measurement World, pp. 45-47, Sept. 1994 - Download |
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J. W. Sofia, "Connector Reliability Testing: A Dualism of Testing Needs", Connection Technology, pp. 41-43, Aug. 1986 - Download |
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S. Dunwoody, E. Bock, J. Sofia, "A Practical and Reliable Method for Detection of Nanosecond Intermittency", Amp Journal of Technology, vol. 5, pp. 54-59, Jun. 1996 - Download |
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