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The Phase 10 Thermal Analyzer and accessories conform to applicable JEDEC thermal test standards. The JEDEC thermal test standards may be downloaded for free at: http://www.jedec.org.
JEDEC Standard JESD51, Methodology for the Thermal Measurement of Component Packages
JEDEC Standard JESD51-1, Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
JEDEC Standard JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
JEDEC Standard JESD51-4, Thermal Test Chip Guideline (Wire Bond Type Chip) Contents
JEDEC Standard JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
JEDEC Standard JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
JEDEC Standard JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
JEDEC Standard JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements |
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