|
|
 |
 |
| |
 |
Analysis Tech offers complete test-lab services for thermal characterization on customer-supplied components. All test services meet the requirements of JEDEC No. 51Standards and MIL STD 750C and 883. All Analysis Tech thermal product capabilities are available for contract test service.
Test results are reported in tabular and graphical formats with typical turnaround times of 1-2 weeks.
Steady-state thermal resistance measurements, junction-to-ambient, junction-to-case, junction-to-board, psi jt, and junction-to-lead are available all devices types. In this regard, up to three different reference sites can be utilized per test. A complete range of fixturing and environmental conditions are available including still air, forced convection, liquid immersion, Rjc (junction-to-case, air or liquid cooled, and Rjb (junction-to-board).
Die attachment evaluation is available for large or small lots. The text-file data and histogram plots are provided. Data for serialized lots are tagged with device serial numbers. Parts tested can also be pass/fail-screened or bin-sorted and bagged according to die attachment quality.
Heating characterization and impedance simulation test services are available for comprehensive evaluation of transient thermal behavior. Transient thermal RC models are derived from the transient thermal response of the device under test and can provide insight into the internal thermal performance of the device. Plots for time-constant spectrum and structure function are also provided. Device impedance plots as a function of heating-cycle-frequency and duty-factor for square waves or arbitrary waveforms are also offered. |
|
|
|
