Analysis Tech Semiconductor Thermal Analyzers - Thermal Testing for Semiconductor Devices

The Analysis Tech Thermal Analyzer Phase 11 provides comprehensive automated control of semiconductor thermal measurements for production and development testing with powerful features such as:

All Test Modes:

▪	Test capabilities for all device-types: diodes, LEDs, bipolars, MOSFETs, IGBTs, functional ICs, thryistors, thermal test dies
▪	Automated high speed data collection, reduction, and analysis
▪	Data plots for all test parameters in all tests modes
▪	Simple, automated "in-lab" instrument-calibration procedures
▪	Various text and graphics file formats for convenient exporting
▪	Continuous intelligent monitoring for errors and data validity
▪	Kelvin (4-wire) connections to eliminate test cable resistances effects
▪	Compatibility with USB, IEEE 488, and RS-232C communications
▪	10/100 Ethernet NIC interface
▪	Test methods compatible with MIL & JEDEC test standards
▪	Selection of automatic power-control by current, wattage, and ΔTj
▪	Standard and custom test fixturing available
▪	Windows XP Pro operating system

Steady State Thermal Resistance Mode:

▪	Multi-junction temperature sensing capability for ICs & multi-die devices
▪	User-selectable thermal equilibrium criteria
▪	Batch-mode for determining power level and air flow effects
▪	Control of accessory laboratory equipment for integrated testing
▪	Infrared case temperature measurement capability
▪	Capability for automatically switching the device under test

Die Attach or Power Pulse Mode:

▪	Pass/Fail or bin sorting based on die-attach quality
▪	Serialized part testing
▪	Data plots of all parameters including die-attach histogram
▪	Extended-life testing with interspersed die-attach testing
▪	Interface for mechanized device handlers
▪	Batch mode die-attachment production testing multi-chip modules

Heating Characterization / Transient Thermal Impedance Mode:

▪	Heating and cooling curve time-resolution: 1 microsecond
▪	Heating and cooling curve span: 1 microsecond - 10,000 seconds
▪	Heating and cooling curve points-per-decade plotted: 15
▪	Utilizes time-constant-spectrum and structure function analyses
▪	Optimized compact dynamic RC models with 2-8 discrete stages

Comparison of Phase 11 to Phase 10 Thermal Analyzers:

▪	Enhanced transient measurement capabilities
▪	Higher data acquisition and processing speeds
▪	Separate PC for improved accessibility for alteration or repair
▪	Compatible with all existing Analysis Tech fixturing.
▪	More compact design